Optical Fault Isolation | Meridian WS-DP | Thermo Fisher Scientific

With time-to-yield being critical to profitability, it is too costly for advanced foundries, integrated device manufacturers and fabless companies to wait until after dicing and packaging to identify the source of electrical faults. The Thermo Scientific Meridian WS-DP system enables faster defect localization by using production testers, load boards, and probe cards.

All diagnostic options from the Meridian product line are available for the Meridian WS-DP, including: LVx, emission, LADA, and OBIRCH.

The Meridian WS-DP system provides:

Ability to identify systematic defects
Significantly increased electrical measurement throughput
Improved defect localization success rate
Reduced physical analysis time

Capabilities:

Standard InGaAs-based emission detection or
High sensitivity extended-wavelength DBX-based emission detection
Patented, industry-proven "Point & Click" Solid Immersion Lens (SIL)
Rapid die-to-die indexing
Dynamic fault coverage with high-speed ATE interface
Laser scanning microscope (LSM) for static and dynamic analysis
Compatibility with most popular third-party EDA applications

Key Features

Laser voltage imaging

Laser voltage imaging (LVI), shows the physical locations of transistors that are active at a specific frequency on the Meridian WS-DP system.

CW laser voltage probing

Continuous wave laser voltage probing (CW-LVP) acquires functional waveform data on the Meridian WS-DP system.

Photon emission microscopy

Photon emission microscopy (PEM) on the Meridian platform is based on an optimized combination of a high sensitivity InGaAs or DBX camera and high numerical aperture (NA) aberration-corrected optics. The Meridian WS-DP system provides high-resolution through-silicon imaging for backside device analysis. Low noise and high sensitivity enable emission data with unmatched signal-to-noise ratios, resulting in rapid, transistor-level fault detection. The DBX configuration provides industry-leading results even on sub-0.5 Vdd devices.

Specifications

Mechanical	ATE compatibility	Commercially available ATE testers & customized solutions
	Probe Card / Load Board	9.5", 12", 18" round probe cards Direct probe load boards 440mm & 300mm probe cards Customized solutions available for non-standard geometries
	Probe pin count	Probe arrays of <100 to >10,000 pins
	Wafer Stage vacuum	20lbs vacuum force for wafer stability
Motion Control	Die-to-die stepping	Supported and integrated into Sierra software
	Platen motion	+/- 5 degrees of rotation 16um theta resolution
	Wafer / DUT supported	9.5", 12", 18" round probe cards Direct probe load boards 440mm & 300mm probe cards Customized solutions available for non-standard geometries
	XYZ microscope stage accuracy	1 um
	XY wafer stage accuracy	5um
	Die size compatibility	A wide range of solutions